Tag: HPC

Synopsys and Broadcom Demonstrate PCIe 6.x Interoperability at 64 GT/S, Targeting AI Scale-up
Olivier Blanchard, Research Director at Futurum, shares his insights on Synopsys demonstrating PCIe 6.x interoperability with Broadcom, reducing design risk and accelerating AI and HPC system deployment.
AMD Powers El Capitan, Frontier, and 172 Systems in Latest Top500 Rankings
Olivier Blanchard, Research Director at Futurum, shares his insights on AMD’s supercomputing leadership as El Capitan and Frontier hold top rankings, while AMD expands its global footprint across HPC and AI workloads.
Armando Acosta, Director at Dell Technologies, joins hosts to shed light on powering AI journeys with the PowerEdge XE portfolio, emphasizing innovation in serviceability and management.
In our latest Research Brief, Hammerspace Tier 0: Unlocking Greater Efficiency in GPU-Driven Computing, The Futurum Group explores how organizations can overcome latency and storage inefficiencies by unlocking stranded NVMe capacity within GPU servers.
Lightmatter Breakthrough 3D Photonic Interposer Tech Provides Highest Bandwidth and Largest Die Complexes for AI Infrastructure Chips
The Futurum Group’s Ron Westfall shares his insights on why Lightmatter can be a frontrunner in photonic supercomputing through its Passage M1000 and L200 products aimed at transforming AI infrastructure with breakthrough 3D photonic innovation.
Custom Arm Neoverse V2 Chip Posts Gains in AI, HPC, and General Compute Across C4A VMs
Richard Gordon, VP & Practice Lead, Semiconductors at The Futurum Group, unpacks Google Axion’s strong benchmarks across AI, HPC, and cloud workloads, showing how Google’s custom Arm CPU could reshape enterprise infrastructure.
Synopsys Introduces HAPS-200 and ZeBu-200, Extending Its Leadership in Hardware-Assisted Verification for Next-Gen Semiconductor Designs
Richard Gordon, VP & Practice Lead, Semiconductors at The Futurum Group, explores how Synopsys’ HAV expansion with HAPS-200 and ZeBu-200 tackles AI, multi-die complexity, and scalable verification in semiconductor design.
Sergi Girona, Operations Director at Barcelona Supercomputing Center, and Scott Tease, VP at Lenovo, share insights on enhancing high-performance computing and sustainability through their partnership, highlighting the deployment of MareNostrum 5 with Lenovo's Neptune Water Cooling Technology for environmental efficiency.
Karan Batta, SVP at Oracle, joins Daniel Newman and Patrick Moorhead on the latest episode to share his insights on migrating Oracle Database workloads to AWS, underscoring the pivotal Oracle-AWS partnership.
The Ultimate Technology Petting Zoo
Camberley Bates at The Futurum Group covers the SuperComputing 2024: A Playground for the Future of Technology.
The Futurum Group’s latest research report, Redefining AI, Hybrid Cloud, and Enterprise Workloads with Cooling Innovations, completed in partnership with HPE, explores the issues companies face as data centers scale to accommodate rapidly expanding compute demands, such as AI workloads, liquid cooling is becoming essential, reducing energy costs, minimizing thermal limitations, and enabling more compact and sustainable infrastructure for the next generation of AI advancements.
Hammerspace Announced New Appliance Offerings for Its Global Data Platform Software
Mitch Lewis Research Analyst at The Futurum Group, covers Hammerspace’s announcement of new appliance offerings.

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