Category: Semiconductors, Supply Chain, & Emerging Tech

Cadence and NVIDIA
April 20, 2026

Cadence and NVIDIA Double Down on AI-Driven Engineering—Accelerated Computing Bridges Simulation and Verification

Cadence and NVIDIA have announced an expanded partnership embedding agentic AI and GPU acceleration into simulation and verification platforms, reshaping engineering productivity across RTL design, analog, and 3D IC workflows....
Meta’s MTIA Partnership With Broadcom Solidifies the Future of XPUs in Inference Optimization
April 20, 2026

Meta’s MTIA Partnership With Broadcom Solidifies the Future of XPUs in Inference Optimization

Brendan Burke, Research Director at Futurum, examines how the Meta Broadcom MTIA partnership expands custom AI silicon and tests whether multi-gigawatt infrastructure can scale efficiently....
Wayve's $60M Series D Extension: Can UK AI Autonomy Compete With US and China?
April 17, 2026

Wayve’s $60M Series D Extension: Can UK AI Autonomy Compete With US and China?

Wayve's $60M Series D from AMD, Arm, and Qualcomm signals backing for sovereign AI, but questions remain whether the UK startup can compete with better-capitalized US and Chinese rivals amid...
Synopsys Extends Simulation Reach to the Lunar Surface via Artemis Program
April 15, 2026

Synopsys Extends Simulation Reach to the Lunar Surface via Artemis Program

Brendan Burke, Research Director at Futurum, examines how Synopsys supports NASA's Artemis program with electromagnetic simulation and digital twin technology for spacesuit safety and lunar cellular network validation....
Unblocking AI Compute: SiFive Intelligence’s Open Solution for Edge to Cloud Scale
April 14, 2026

Unblocking AI Compute: SiFive Intelligence’s Open Solution for Edge to Cloud Scale

In our latest Market Report, Unblocking AI Compute: SiFive Intelligence’s Open Solution for Edge to Cloud Scale, completed in partnership with SiFive, Futurum Research explores how shifting AI workload demands...
CoreWeave's Anthropic and Meta Partnerships
April 13, 2026

CoreWeave’s Anthropic and Meta Wins Validate Benchmark Outperformance

Brendan Burke, Research Director at Futurum, examines how CoreWeave's $21B Meta deal and Anthropic partnership validate the neocloud model for frontier AI infrastructure built on MLPerf-leading performance....
compute partnership
April 13, 2026

Anthropic’s Google-Broadcom Deal: Model Company or Infrastructure Play?

Anthropic's Google and Broadcom partnership signals a strategic pivot toward supply chain control, raising questions about whether vertical integration will strengthen or dilute its model-first identity....
Will Intel Xeon CPUs Increase Google’s CPU:XPU Ratio?
April 13, 2026

Will Intel Xeon CPUs Increase Google’s CPU:XPU Ratio?

Brendan Burke, Research Director at Futurum, examines how Intel and Google's multiyear collaboration on Xeon CPUs and custom IPUs reframes the CPU as a strategic layer in heterogeneous AI infrastructure....
April 10, 2026

26 Header

Will SiFive's $400 Million Round Unblock the Data Center CPU Bottleneck?
April 10, 2026

Will SiFive’s $400 Million Round Unblock the Data Center CPU Bottleneck?

Brendan Burke, Research Director at Futurum, examines how SiFive's $400M Series G positions RISC-V to address the AI memory wall through decoupled vector architecture and latency-hiding queues for data center...
Can Intel Foundry’s Advanced Packaging Bring the Terafab Vision to the Stars
April 10, 2026

Can Intel Foundry’s Advanced Packaging Bring the Terafab Vision to the Stars?

Brendan Burke, Research Director at Futurum, examines how Intel's Terafab partnership with Tesla, SpaceX, and xAI positions Intel Foundry as a domestic advanced packaging and fabrication alternative at scale....
Applied Materials Arms Chipmakers for the GAA Era With Angstrom-Class Tools
April 9, 2026

Applied Materials Arms Chipmakers for the GAA Era With Angstrom-Class Tools

Brendan Burke, Research Director at Futurum, shares his analysis of Applied Materials' new GAA deposition systems and what the shift from lithography-led scaling to materials engineering means for the $115...

Newsletter Sign-up Form

Get important insights straight to your inbox, receive first looks at eBooks, exclusive event invitations, custom content, and more. We promise not to spam you or sell your name to anyone. You can always unsubscribe at any time.

All fields are required






Thank you, we received your request, a member of our team will be in contact with you.