Menu

Why Qualcomm’s Automotive-Grade Wi-Fi 7 Is Great News for Automakers

Why Qualcomm’s Automotive-Grade Wi-Fi 7 Is Great News for Automakers

The News: Qualcomm Technologies is extending its connectivity lineup with the latest addition to its Snapdragon Auto Connectivity platform, Qualcomm QCA6797AQ, the industry’s first automotive-grade Wi-Fi 7 access point solution. Read the press release on Qualcomm’s news page.

Why Qualcomm’s Automotive-Grade Wi-Fi 7 Is Great News for Automakers

Analyst Take: As next-generation applications and in-vehicle experiences increasingly drive the need for greater capacity, higher data rates, and more robust wireless connections, vehicle connectivity has emerged as an essential foundation of software-defined vehicle (SDV) architectures. Qualcomm’s Snapdragon Auto Connectivity platform, which provides a comprehensive portfolio of connectivity solutions that includes cellular 5G/4G, Wi-Fi, Bluetooth, C-V2X, and precise positioning technologies, is designed to enable Qualcomm’s OEM partners to deliver seamless in-vehicle connectivity experience.

Qualcomm’s introduction of the industry’s first automotive-grade Wi-Fi 7 access point solution to the market is only the latest milestone in the company’s goal to create a full technology solutions stack for automotive OEMs, but a critical one, because Wi-Fi 7 introduces important technological innovations to the market:

  • High Band Simultaneous (HBS)
  • Multi-link Multi-Radio (MLMR)
  • 320 MHz channel bandwidth
  • 4K Quadrature Amplitude Modulation (QAM)
  • Adaptive Puncturing

HBS + MLMR = Improved Connection Reliability

Support for HBS MLMR Wi-Fi 7 significantly reduces the incidence of dropped connections caused by common external interference, often found at congested intersections and near fixed wireless links and tollbooths. It also enables more reliable connections for uninterrupted data transfers and lower latencies by continuously selecting the best available channel between 5 GHz and 6 GHz for each device in the vehicle. This translates into better experiences for streaming, gaming, and other “latency-sensitive applications.”

320 MHz + QAM + Adaptive Puncturing = Higher Capacity and Faster Connectivity

Wi-Fi 7 also improves capacity enabled through the 6 GHz spectrum, opening up 320 MHz channels, and in combination with 4K QAM, Wi-Fi 7 can achieve peak throughputs of up to 5.8 Gbps. This is especially useful to keep high-definition maps downloading fast even as the vehicle is moving. Adaptive Puncturing, for its part, makes more efficient use of the spectrum by granting the vehicle access to a wider channel range even when part of the channel is unavailable. This is important as more Wi-Fi devices in use inside vehicles means more demand for capacity, higher data rates, and lower latencies. Wi-Fi 7 creates a bandwidth on-ramp for these in-vehicle experiences to scale.

Why Connectivity Is the Real MVP of Automotive UX

Over-the air (OTA) software updates are faster with Wi-Fi 7. This means that automotive OEMs can push out software updates and collect vehicle data a lot faster at charging stations, retail locations, and dealerships, both in consumer and commercial markets. Rental companies can also offer enhanced features and customer experiences for limited durations as a premium feature. This also makes fleet management and logistics a lot more reliable and efficient.

“As vehicles increasingly integrate connectivity, automakers and fleet service providers find themselves presented with new opportunities to provide connected services. These services not only create ongoing sources of revenue, but also redefine business models and change the dynamics of how automakers engage with vehicle owners,” Qualcomm explains. This approach to solutions design hits all of the right targets for the value proposition of next-gen vehicle connectivity. With over 450 Wi-Fi 7 design wins across virtually all device categories, Qualcomm is uniquely positioned to bring Wi-Fi 7 enhancements to the automotive sector. The addition of the QCA6797AQ into the Snapdragon Auto Connectivity platform feels like not only the natural next brick in the company’s automotive solutions stack but yet another differentiator for OEMs looking to not only address but leverage real bandwidth, safety, and UX challenges. In the consumer segment, it means fewer UX headaches, enhanced experiences, and a wider on-ramp for service providers. In the commercial segment, it also means more visibility, control, and peace of mind for fleet operators and logistics teams.

Disclosure: The Futurum Group is a research and advisory firm that engages or has engaged in research, analysis, and advisory services with many technology companies, including those mentioned in this article. The author does not hold any equity positions with any company mentioned in this article.

Analysis and opinions expressed herein are specific to the analyst individually and data and other information that might have been provided for validation, not those of The Futurum Group as a whole.

Other Insights from The Futurum Group:

Qualcomm’s Snapdragon Digital Chassis Will Power the 2025 Escalade IQ

Qualcomm Snapdragon Latest Auto 5G Modem-RF Unveiled at MWC

5G Factor: Qualcomm, Ethernovia, Cadillac Prep AI-Infused SDV Highway Star Era

Author Information

Olivier Blanchard

Olivier Blanchard is Research Director, Intelligent Devices. He covers edge semiconductors and intelligent AI-capable devices for Futurum. In addition to having co-authored several books about digital transformation and AI with Futurum Group CEO Daniel Newman, Blanchard brings considerable experience demystifying new and emerging technologies, advising clients on how best to future-proof their organizations, and helping maximize the positive impacts of technology disruption while mitigating their potentially negative effects. Follow his extended analysis on X and LinkedIn.

Related Insights
SK Hynix Q4 FY 2025 Structural Shift to AI Memory Lifts Margins
February 2, 2026

SK Hynix Q4 FY 2025: Structural Shift to AI Memory Lifts Margins

Futurum Research analyzes SK Hynix’s Q4 FY 2025 results, highlighting HBM leadership, DDR5 server mix, and NAND roadmap, and why capacity, packaging, and customer alignment position the company for sustained...
Samsung Electronics Q4 FY 2025 Highlights AI-Driven Memory Strength
February 2, 2026

Samsung Electronics Q4 FY 2025 Highlights AI-Driven Memory Strength

Futurum Research analyzes Samsung’s Q4 FY 2025 results, highlighting AI-driven memory momentum, HBM and server SSD mix, foundry 2nm progress, and how 2026 supply, CapEx, and guidance shape execution....
Lam Research Q2 FY 2026 Highlights AI-Driven Demand and Packaging Gains
January 30, 2026

Lam Research Q2 FY 2026 Highlights AI-Driven Demand and Packaging Gains

Futurum Research analyzes Lam Research’s Q2 FY 2026 results, highlighting AI-driven WFE demand, GAA and advanced packaging adoption, and CSBG automation scale, with guidance pointing to a second-half weighted FY...
ASML Q4 FY 2025 Earnings Record Orders, Capacity Execution in Focus
January 30, 2026

ASML Q4 FY 2025 Earnings: Record Orders, Capacity Execution in Focus

Futurum Research analyzes ASML’s Q4 FY 2025, highlighting EUV momentum, backlog coverage into 2027, and how fab readiness, mix, and upgrades shape 2026 execution and margins....
Texas Instruments Q4 FY 2025 Earnings Highlight Industrial, Auto, DC Traction
January 29, 2026

Texas Instruments Q4 FY 2025 Earnings Highlight Industrial, Auto, DC Traction

Futurum Research analyzes TI’s Q4 FY 2025 results, highlighting industrial and automotive recovery and rising data center mix, with 300mm capacity and inventory strategy positioning TI for improving near-term demand....
IonQ Buys a Foundry Is Vertical Integration the Path to Fault-Tolerant Quantum
January 28, 2026

IonQ Buys a Foundry: Is Vertical Integration the Path to Fault-Tolerant Quantum?

Futurum’s Nick Patience and Brendan Burke examine why IonQ’s acquisition of SkyWater signals that fault-tolerant quantum computing is now a manufacturing and supply-chain challenge, not just a physics one....

Book a Demo

Newsletter Sign-up Form

Get important insights straight to your inbox, receive first looks at eBooks, exclusive event invitations, custom content, and more. We promise not to spam you or sell your name to anyone. You can always unsubscribe at any time.

All fields are required






Thank you, we received your request, a member of our team will be in contact with you.