Menu

AMD and Qualcomm Optimize FastConnect for AMD Ryzen CPUs

The News: AMD and Qualcomm Technologies, Inc., are collaborating to optimize Qualcomm’s FastConnect Wi-Fi 6, Wi-Fi 6E, Bluetooth 5.3 and advanced audio technologies for use in AMD’s Ryzen CPU-based computing platforms for Windows 11 business laptops. The first AMD and Qualcomm Technologies products to be brought together with the bolstered capabilities will be AMD’s Ryzen PRO 6000 Series processors and the Qualcomm FastConnect 6900 chips. Read the full Press Release from AMD.

AMD and Qualcomm Optimize FastConnect for AMD Ryzen CPUs

Analyst Take: AMD and Qualcomm are making a smart and logical move to bring together Qualcomm’s FastConnect system with AMD’s latest Ryzen CPUs for use in upcoming Windows 11 business-focused laptops, promising even greater performance for business users.

The FastConnect chips, which are built by Qualcomm subsidiary Qualcomm Technologies, integrate Wi-Fi 6, Wi-Fi 6E, Bluetooth 5.3 and advanced audio technologies into one chip that is designed to increase speeds and performance for mobile computing platforms. By creating this combination, the companies will push higher performance capabilities to more business users and computing form factors, which makes this a great and effective collaboration.

Ever since the first iPhone debuted in 2007, launching the modern smartphone market, mobile devices – particularly for business – have continued to push the edge of the performance envelope, fueled by user demands for ever-greater speeds and compute power. That insatiable need for speed is inevitable, in everything from cars to blenders to washing machines and just about every other machine we use on a regular basis. With that in mind, this collaboration between AMD and Qualcomm to further refine and combine their technologies to deliver faster Wi-Fi 6, Wi-Fi 6E, Bluetooth 5.3 and advanced audio technologies is just what business users are demanding.

AMD and Qualcomm Product Details

The first AMD Ryzen CPUs to gain the Qualcomm FastConnect capabilities will be the AMD Ryzen PRO 6000 Series processors, which will be paired with the capabilities from Qualcomm’s FastConnect 6900 chips, according to the partners. The collaboration also includes broad out-of-band WiFi remote management capabilities for IT administrators to keep the systems operating at peak efficiency, even when they are being used in remote out-of-office locations.

The Qualcomm FastConnect 6900 is a 14nm 2×2 Mobile Connectivity system that extends the power of Wi-Fi 6 into the 6 GHz band (Wi-Fi 6E). The FastConnect systems feature Wi-Fi speeds up to 3.6 Gbps, along with VR-class low latency delivered to new and clean 6GHz spectrum.

The boosted capabilities are aimed at improving video conferencing by reducing call latency and improving connections for business laptop users wherever they are working, as well as delivering other performance benefits.

AMD and Qualcomm Collaboration Overview

By combining AMD’s Ryzen PRO Series 6000 CPUs and Qualcomm’s Fast Connect 6900 chips to achieve additional speed, reliability and compute improvements, AMD and Qualcomm are moving the performance needle for business laptops and other mobile devices. It will be interesting to watch as AMD and Qualcomm expand these capabilities to additional CPUs and FastConnect systems in their product lines and drive business mobile device performance to even higher levels.

Disclosure: Futurum Research is a research and advisory firm that engages or has engaged in research, analysis, and advisory services with many technology companies, including those mentioned in this article. The author does not hold any equity positions with any company mentioned in this article.

Analysis and opinions expressed herein are specific to the analyst individually and data and other information that might have been provided for validation, not those of Futurum Research as a whole.

Other insights from Futurum Research:

Amdocs, AWS, and T-Mobile Form AI-powered Business Assurance Power Trio

AMD Acquires Pensando

AMD Closes Xilinx

Image Credit: AMD
Related Insights
Texas Instruments Q4 FY 2025 Earnings Highlight Industrial, Auto, DC Traction
January 29, 2026

Texas Instruments Q4 FY 2025 Earnings Highlight Industrial, Auto, DC Traction

Futurum Research analyzes TI’s Q4 FY 2025 results, highlighting industrial and automotive recovery and rising data center mix, with 300mm capacity and inventory strategy positioning TI for improving near-term demand....
IonQ Buys a Foundry Is Vertical Integration the Path to Fault-Tolerant Quantum
January 28, 2026

IonQ Buys a Foundry: Is Vertical Integration the Path to Fault-Tolerant Quantum?

Futurum’s Nick Patience and Brendan Burke examine why IonQ’s acquisition of SkyWater signals that fault-tolerant quantum computing is now a manufacturing and supply-chain challenge, not just a physics one....
AI Is the Largest Infrastructure Buildout Ever—Are Investments Keeping Up
January 28, 2026

AI Is the Largest Infrastructure Buildout Ever—Are Investments Keeping Up?

Brendan Burke, Research Director at The Futurum Group, examines Jensen Huang’s view of AI as the largest infrastructure buildout in human history and why value is shifting to the application...
Microsoft’s Maia 200 Signals the XPU Shift Toward Reinforcement Learning
January 27, 2026

Microsoft’s Maia 200 Signals the XPU Shift Toward Reinforcement Learning

Brendan Burke, Research Director at Futurum, analyzes Microsoft’s custom Maia 200 architecture and market position. The accelerator supports reinforcement learning with low-precision formats and deterministic networking....
Amazon EC2 G7e Goes GA With Blackwell GPUs. What Changes for AI Inference
January 27, 2026

Amazon EC2 G7e Goes GA With Blackwell GPUs. What Changes for AI Inference?

Nick Patience, VP and AI Practice Lead at Futurum, examines Amazon’s EC2 G7e instances and how higher GPU memory, bandwidth, and networking change AI inference and graphics workloads....
NVIDIA and CoreWeave Team to Break Through Data Center Real Estate Bottlenecks
January 27, 2026

NVIDIA and CoreWeave Team to Break Through Data Center Real Estate Bottlenecks

Nick Patience, AI Platforms Practice Lead at Futurum, shares his insights on NVIDIA’s $2 billion investment in CoreWeave to accelerate the buildout of over 5 gigawatts of specialized AI factories...

Book a Demo

Newsletter Sign-up Form

Get important insights straight to your inbox, receive first looks at eBooks, exclusive event invitations, custom content, and more. We promise not to spam you or sell your name to anyone. You can always unsubscribe at any time.

All fields are required






Thank you, we received your request, a member of our team will be in contact with you.