To meet escalating compute demands, the industry needs breakthroughs in materials, process integration, and manufacturing scalability. Applied Materials’ leadership in advanced packaging and collaboration with Besi have produced the industry’s first fully integrated die-to-wafer hybrid bonding system. The Kinex™ platform consolidates every step of the bonding process to deliver higher yields, faster cycle times, and the reliability required for high-volume manufacturing in the AI era.
In our latest Market Brief, Hybrid Bonding at Scale: Powering the Next Era of Semiconductor Packaging, developed in partnership with Applied Materials, Futurum Research examines how hybrid bonding is reshaping semiconductor design and manufacturing. The report explores Applied’s integrated materials approach, the technical breakthroughs behind Kinex, and the long-term implications for chipmakers pursuing advanced logic, memory, and packaging integration.
In this brief, you will learn:
- Why advanced packaging and hybrid bonding are now the foundation of post-Moore’s Law scaling
- How Applied Materials and Besi’s Kinex™ platform integrates every step of die-to-wafer bonding
- The performance, yield, and productivity benefits enabled by integrated queue-time control and metrology
- Analyst insights into the market outlook and adoption curve for hybrid bonding through 2030
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Author Information
Ray Wang is the Research Director for Semiconductors, Supply Chain, and Emerging Technology at Futurum. His coverage focuses on the global semiconductor industry and frontier technologies. He also advises clients on global compute distribution, deployment, and supply chain. In addition to his main coverage and expertise, Wang also specializes in global technology policy, supply chain dynamics, and U.S.-China relations.
He has been quoted or interviewed regularly by leading media outlets across the globe, including CNBC, CNN, MarketWatch, Nikkei Asia, South China Morning Post, Business Insider, Science, Al Jazeera, Fast Company, and TaiwanPlus.
Prior to joining Futurum, Wang worked as an independent semiconductor and technology analyst, advising technology firms and institutional investors on industry development, regulations, and geopolitics. He also held positions at leading consulting firms and think tanks in Washington, D.C., including DGA–Albright Stonebridge Group, the Center for Strategic and International Studies (CSIS), and the Carnegie Endowment for International Peace.
